contact us
support | newsroom | testimonials | datasheets | request a quote
 
INVERTERS> IAP200T060H
 
Applied Power Systems, Inc.
124 Charlotte Ave. Hicksville, NY 11801
P: (516) 935-2230 - F: (516) 935-2603
 
 

 

IAP200T060H SixPac™
Three Phase Inverter

Description

The SixPacTM from Applied Power Systems is a configurable IGBT based power stage that may be used as a converter, chopper, half or full bridge, or three phase inverter for motor control, power supply, UPS or other power conversion applications.

The IGBTs for the power assembly are mounted on a forced air-cooled or water cooled heat sink.  The switching devices interface with a capacitor bank via a low inductance laminated bus.  The gate drive board provides a simple user interface along with protection features including: overvoltage, overcurrent, undervoltage lockout, overtemperature, and short circuit protection.

Depending on application characteristics, the SixPacTM is suitable for operation with DC bus voltages up to 800 VDC and switching frequencies above 20 KHz.

   FEATURES INCLUDE
• High performance IGBT inverter bridge
• Integrated gate drive board with fault monitoring and protection
• System status / troubleshooting LEDs to verify or monitor proper operation
• Isolated, low level (100:1), analog feedback of DC bus voltage
• Isolated gate drive power supplies
• Low inductance laminated bus
• Output current measurement and feedback
• Superior short circuit protection and shoot through prevention
 
Schematic

IAP-6616 Schematic

 
Absolute Maximum Ratings, Tj = 25°C unless otherwise specified
General Symbol   Units
IGBT Junction Temperature Tj -40 to +150 °C
Storage Temperature Tstg -40 to +150 °C
Operating Temperature Top -25 to +85 °C
Voltage Applied to DC terminals Vcc 800 Volts
Isolation Voltage, AC 1 minute, 60 Hz sinusoidal Viso 2500 Volts
IGBT Inverter*      
Collector Current (Tc = 25°C) Ic 200 Amps
Peak Collector Current (Tj < 150°C) ICM 400 Amps
Emitter Current IE 200 Amps
Peak Emitter Current IEM 400 Amps
Maximum Collector Dissipation (Tj < 150°C) Pc 590 Watts
Gate Drive Board      
Unregulated +24V Power Supply   30 Volts
Regulated +15V Power Supply   18 Volts
PWM Signal Input Voltage   20 Volts
Fault Signal Output Supply Voltage   30 Volts
Fault Signal Output Current   50 mA
* These parameters are for each IGBT.  There are two IGBTs in parallel.
 
IGBT Inverter Electrical Characteristics, Tj = 25°C unless otherwise specified
Characteristics Symbol Test Conditions Min Typ Max Units
Collector Cutoff Current ICES VCE =VCES ,
VGE =0V		 - - 1 mA
Collector-Emitter Saturation Voltage VCE(SAT) IC =150A, Tj =25°C - 5.0 6.5 Volts
    IC =150A, Tj =125°C - 5.0 - Volts
Emitter-Collector Voltage VEC IE =150A - - 3.5 Volts
Inductive Load Switching Times td(on) VCC =600V
IC =150A
VGE =15V
RG =2.1Ω		 - - 300 ηS
  tr - - 80 ηS
  td(off) - - 500 ηS
  tf - - 150 ηS
Diode Reverse Recovery Time trr - - 250 ηS
Diode Reverse Recovery Charge Qrr - 7.5 - µC
DC Link Capacitance       4950   µF
 
Gate Drive Board Electrical Characteristics
Characteristics Min Typ Max Units
Unregulated +24V Power Supply 20 24 30 Volts
Regulated +15V Power Supply 14.4 15 15.6 Volts
PWM Input On Threshold 12 15   Volts
PWM Input Off Threshold   0 2 Volts
Output Overcurrent Trip 310 325 340 Amps
Overtemperature Trip 88 90 92 °C
Overvoltage Trip 885 900 915 Volts
DC Link Voltage Feedback   See Figure Below Volts
Heatsink Temperature Feedback   See Figure Below Volts
Output Current Feedback   See Figure Below Volts
 
 
Thermal and Mechanical Characteristics
Characteristics Symbol Test Conditions Min Typ Max Units
IGBT Thermal Resistance, Junction to Case Rth(j-c)Q Per IGBT 1/2 module - - .15 °C/W
FWD Thermal Resistance, Junction to Case Rth(j-c)D Per FWD 1/2 module - - .24 °C/W
Contact Thermal Resistance Rth(c-f)   - .02   °C/W
Heatsink Thermal Resistance Rth(f-a) 2500 LFM   .03   °C/W
Mounting Torque, AC Terminals       75 90 In-lb
Mounting Torque, DC Terminals       130 150 In-lb
Mounting Torque, Mounting plate       130 150 In-lb
Weight         30 lb
 

Gate Drive Board Interface Connector Signal Definitions

J1
Pin Signal Name Description
1 Shield Low resistance connection to ground
2 PWM A- 0 – 15V signal controlling the duty cycle of A- IGBT
3 Phase A Error1 Open collector output, external pull-up resistor required
LOW = No Error; Floating = Phase A overcurrent or short circuit
4 PWM A+ 0 – 15V signal controlling the duty cycle of A+ IGBT
5 PWM B- 0 – 15V signal controlling the duty cycle of B- IGBT
6 Phase B Error1 Open collector output, external pull-up resistor required
LOW = No Error; Floating = Phase B overcurrent or short circuit
7 PWM B+ 0 – 15V signal controlling the duty cycle of B+ IGBT
8 PWM C- 0 – 15V signal controlling the duty cycle of C- IGBT
9 Phase C Error1 Open collector output, external pull-up resistor required
LOW = No Error; Floating = Phase C overcurrent or short circuit
10 PWM C+ 0 – 15V signal controlling the duty cycle of C+ IGBT
11 Overtemperature, UVLO, or Overvoltage1 Open collector output, external pull-up resistor required
LOW = No Error; Floating = Heatsink overtemp, UVLO fault, or DC bus overvoltage
12 Not Connected  
13 DC Bus Voltage Analog voltage representation of DC bus voltage
14 24 VDC Input Power2 20 – 30 VDC input voltage range
15 24 VDC Input Power2 20 – 30 VDC input voltage range
16 15 VDC Input Power2 14.4 - 15 VDC input voltage range
17 15 VDC Input Power2 14.4 - 15 VDC input voltage range
18 GND Ground reference for 15 and 24 VDC inputs
19 GND Ground reference for 15 and 24 VDC inputs
20 Heatsink Temperature Analog voltage representation of heatsink temperature
21 GND3 Tied to pins 18 and 19 on gate drive board
22 Iout Phase A Analog voltage representation of Phase A output current
23 GND3 Tied to pins 18 and 19 on gate drive board
24 Iout Phase B Analog voltage representation of Phase B output current
25 GND3  
26 Iout Phase C Analog voltage representation of Phase C output current
NOTES:
1. Open collectors can be pulled up to 30VDC Max and sink 50mA continuous.
2. DO NOT connect a 15VDC and 24VDC source to the unit at the same time.  Use one or the other.
3. GND signals to be used for analog feedback signals, i.e. twisted pair with IOUT Phase A.
 
 
Gate Drive Board Interface Connector
Description Symbol Type Manufacturer
Gate Drive Board Interface Header J1 0.100” x 0.100” latching header, 16 pin 3M# 3408-6002 or equivalent
Recommended Mating Socket - 0.100” x 0.100” IDC socket, 16 pin 3M# 3452-7600 or equivalent
Recommended Strain Relief - Plastic strain relief 3M# 3448-3016 or equivalent
 

Performance Curves

SIXPAC Three Phase Inverter
 
Condition Symbol Value Units
Ambient Temperature TA 40 °C
DC Bus Voltage VCC 500 Volts
Load Power Factor cos f 0.8  
IGBT Saturation Voltage VCE(SAT) Typical @ TJ = 125°C Volts
IGBT Switching Loss ESW Typical @ TJ = 125°C mJ
Airflow - 2500 LFM
 

Mechanical Information

Mechanical Drawings
 
 Output