IAP300T120 Integrated Advanced PowerStack

300A / 1200V 3-phase Bridge IGBT Inverter

 

 DOWNLOAD IAP300T120 DATASHEET
FEATURES INCLUDE
Multi-Function Power Assembly
Compact Size –8.00” H X 11.00” W X 17.56” D
DC Bus Voltages to 850VDC
Snubber-less operation to 650VDC
Switching frequencies to over 20kHz
Protective circuitry with fail-safe opto-isolated fault annunciation, including:
  • OverCurrent
• OverVoltage
• OverTemperature
• Short circuit
• P.S. UnderVoltage
Opto-isolated or fiber-optic gate drive and fault signal output for electrical isolation and noise immunity
Integrated cooling with temperature sensors and feedback
Many options-SCR/Diode Front End, etc.
Configurable Power

The IAP-300T120 PowerStack is a flexible, highly integrated IGBT based power assembly with a wide range of applications.  These include inverters for motor controls, switch mode power supplies (SMPS), UPS, welders, etc.  The IAP300T120 PowerStack can be operated at frequencies to over 20kHz.  The IAP300T120 PowerStack is configured as a three-phase bridge inverter mounted on an air-cooled or liquid-cooled heat sink.  Configurations include options for (full, half or no control) converter input circuitry, inverter output circuitry, cooling and a wide variety of drivers and safety features for the converter front end and IGBT inverter output stage.

To operate at high switching frequencies, the IAP300T120 PowerStack utilizes a low inductance laminated bus structure, optically isolated or fiber optically coupled gate drive interfaces, isolated gate power supplies and a DC-link capacitor bank.

The IAP300T120 PowerStack provides built in protection features including: OverVoltage, UnderVoltage lockout, OverCurrent, OverTemperature, short circuit and optional airflow or liquid flow indicators.

Flexibility is a key feature of the IAP300T120 PowerStack.  Options include: a choice of converter front ends, rectifier, half or full SCR control, with or without SCR gate firing boards and soft-start circuitry.  A choice of cooling methods, forced air or liquid is also available.  Customer provided PWM is optically coupled or a fiber optic link can be provided to the IGBT interface.  Current feedback is provided by Hall effect current transducers. 

The IAP300T120 PowerStack is rated to maximum input voltages up to 800 VDC, switching frequencies to over 20kHz, includes many safety features to protect the IGBTs and output circuitry and can be configured to meet your application.

 
 
IAP300T120H PowerStack
Absolute Maximum Ratings – TJ=25°C unless otherwise specified
General Symbol Value Units
IGBT Junction Temperature TJ -40 to +150 °C
Storage Temperature TSTG -40 to +125 °C
Operating Temperature TOP -25 to +85 °C
Voltage applied to DC terminals VCC 850 Volts
Isolation voltage, AC 1 minute, 60Hz sinusoidal VISO 2500 Volts
IGBT Inverter      
Collector Current (TC=25°C) IC 300 Amperes
Peak Collector Current (TJ<150°C) ICM 600 Amperes
Emitter Current IE 300 Amperes
Peak Emitter Current IEM 600 Amperes
Maximum Collector Dissipation (TJ<150°C) PCD 1600 Watts
Gate Drive Board      
Unregulated +24V Power Supply   30 Volts
Regulated +15V Power Supply   18 Volts
PWM Signal Input Voltage   15 Volts
   Factory Settable from 3.3 to 15V      
Fault Output Supply Voltage   30 Volts
Fault Output Current   50 mA
 
IGBT Inverter Electrical Characteristics, TJ=25°C unless otherwise specified
Parameter Symbol Test Conditions Min Typ Max Units
Collector Cutoff Current ICES VCE =VCES , VGE =0V - - 1 mA
Collector-Emitter Saturation Voltage VCE (sat) IC =300A, TJ =25°C - 1.75 2.15 Volts
IC =300A, TJ =125°C - 2.0 - Volts
Emitter-Collector Voltage VEC IE =300A - - 3.2 Volts
Inductive Load Switching Times td(on) VCC =600V

IC =300A

VGE =15V

RG =1.8Ω
- - 200 ηs
tr - - 45 ηs
td(off) - - 500 ηs
tr - - 100 ηs
Diode Reverse Recovery Time Trr - - 250 ηs
Diode Reverse Recovery Charge Qrr - 30.0 - µC
DC Link Capacitance     - 4950 - µF
 
Thermal and Mechanical Parameters
Parameter Symbol Test Conditions Min Typ Max Units
IGBT Thermal Resistance, Junction to Case RΘ(j-c) Per IGBT ½ module - - 0.093 °C/W
FWD Thermal Resistance, Junction to Case RΘ(j-c) Per FWD ½ module - - 0.15 °C/W
Heatsink Thermal Resistance RΘ(s-a) 1500 LFM airflow - .045 - °C/W
Mounting Torque, AC terminals     - 75 90 In-lb
Mounting Torque, DC terminals     - 130 150 In-lb
Mounting Torque, case mounting     - 130 150 In-lb
Weight     - 21 - lb
 
Gate Drive Board Electrical Characteristics
Parameter Min Typ Max Units
Unregulated +24V Power Supply 20 24 30 Volts
Regulated +15V Power Supply 14.4 15 18 Volts
PWM Input On Threshold 12 15 - Volts
PWM Inout Off Threshold - 0 2 Volts
Output Overcurrent Trip - 450 - Amperes
Overtemperature Trip 98 100 102 °C
Overvoltage Trip - 900 - Volts
DC Link Voltage Feedback See Figure Below Volts
Heatsink Temperature Feedback See Figure Below Volts
Output Current Feedback See Figure Below Volts
 
 
 
 
 

Performance Curves
Effective Output Current vs. Carrier Frequency (Typical)
 
Conditions Symbol Value Units
Ambient Temperature TA 40 °C
DC Bus Voltage VCC 600 Volts
Load Power Factor COS Φ 0.8  
IGBT Saturation Voltage VCE(sat) Typical @ TJ=125°C Volts
IGBT Switching Loss ESW Typical @ TJ=125°C mJ
Airflow - 1500 LFM
Switching Conditions Three-phase PWM, 60Hz sinusoidal output
 
Interface
Pin # Signal Name Description
1 Shield Connected to circuit ground
2 PWM A- 0-15V signal controlling the duty cycle of A- IGBT
3 Phase A Error1 Open collector output, external pull-up resistor required. 
LOW=No Error; Floating=Phase A overcurrent or short circuit
4 PWM A+ 0-15V signal controlling the duty cycle of A+ IGBT
5 PWM B- 0-15V signal controlling the duty cycle of B- IGBT
6 Phase B Error1 Open collector output, external pull-up resistor required. 
LOW=No Error; Floating=Phase B overcurrent or short circuit
7 PWM B+ 0-15V signal controlling the duty cycle of B+ IGBT
8 PWM C- 0-15V signal controlling the duty cycle of C- IGBT
9 Phase C Error1 Open collector output, external pull-up resistor required. 
LOW=No Error; Floating=Phase C overcurrent or short circuit
10 PWM C+  
11 OverTemp1 Open collector output, external pull-up resistor required. 
LOW=No Error; Floating=Heatsink overtemp
12 Not Connected  
13 DC Link Voltage Analog voltage representation of DC link voltage
14 24VDC Input Power2 20-30VDC input voltage range
15 24VDC Input Power2 20-30VDC input voltage range
16 15VDC Input Power2 14.4-18VDC input voltage range
17 15VDC Input Power2 14.4-18VDC input voltage range
18 GND Ground reference for 15 and 24VDC inputs
19 GND Ground reference for 15 and 24VDC inputs
20 Heatsink Temperature Analog voltage representation of heatsink temperature
21 GND3 Tied to pins 18 and 19
22 IOUT Phase A Analog voltage representation of phase A output current
23 GND3 Tied to pins 18 and 19
24 IOUT Phase B Analog voltage representation of phase B output current
25 GND3 Tied to pins 18 and 19
26 Iout Phase C Analog voltage representation of phase C output current
 
NOTES:
  1. Open collectors can be pulled up to 30VDC Max and sink 50mA continuous.
  2. DO NOT connect a 15VDC and 24VDC source to the unit at the same time.  Use one or the other.
  3. GND signals to be used for analog feedback signals, i.e. twisted pair with IOUT Phase A.
 
Gate Drive Interface Connector
Description Symbol Type Manufacturer
Gate Drive Interface Header J1 0.100” x 0.100” latching header, 26 pin 3M #3429-6002 or equivalent
Recommending Mating Socket - 0.100” x 0.100” IDC socket, 26 pin 3M #3399-7600 or equivalent
Recommended Strain Relief - Plastic strain relief 3M #3448-3026 or equivalent
 

 

Mechanical Information

 

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