Air Cooled Assemblies

The most efficient way to remove heat from a large area semiconductor (>23mm silicon diameter) is to package it into a flat circular package that allows heat and current to flow from both the anode and cathode of the device with as little thermal and electrical resistance as possible.  This type of package is called by many names, hockey puck, press pack, flat pack and disc. From a user’s point of view, it is the most difficult package to use since it not only requires two heat sinks (anode and cathode) but also requires a clamp to hold the assembly together and to apply sufficient force to minimize the thermal and electrical resistance.  The proper clamping force ensures optimum electrical and thermal connections to the device. In addition, the method used to tighten and accurately gauge the applied force is not trivial.  Over tightening, under tightening and/or not maintaining a parallel force on the pole face of the device often leads to premature device failure.  The APS clamp design provides solutions to these problems.

 The clamping force applied to the semiconductor pole faces is critical and must adhere to manufacturers specifications.  It is also necessary for the clamping force to be applied evenly across the entire surface of both pole faces and normal to the pole face plane of the assembled devices.  The clamp must apply the force evenly across the pole faces and not cause mechanical stress to be transferred to the semiconductor element over the entire temperature range to which the assembly will be exposed.  Stress caused by non-perpendicular application of the clamp can cause a number of problems including cracking the semiconductor element, current crowding which may cause excessive hot spots on the semiconductor, poor thermal conduction which may cause overheating of the semiconductor, etc.  Properly designed and installed disc clamps will provide good electrical contact and a low thermal resistance. 

Below are examples of Power Semiconductor Assemblies designed and manufactured by APS using both standard and custom heatsinks and clamps.

 

 

 

 

 

Below are examples of Power Semiconductor Assemblies designed and manufactured by APS using both standard and custom heatsinks and clamps.

Click on each one to view several examples.

 
 

High Power Inverters

High Power Inverters

5-500 kilowatt Inverters, AC Controllers and IGBT Inverters are available with Full Bridge, Half Bridge, 3-Phase Bridge, Chopper and Soft Start Circuits.  Options include Air or Liquid Cooled, Voltage Feedback, Current Feedback, Thermal Feedback, Snubbers,  Laminated Bus, DC Filter Capacitors, Fuses, and Blowers/Fans. Our Single Phase or 3-Phase Inverters are designed to fit a wide range of applications or custom designed to fit uniqe requirments.

High Power Converters

High Power Converters

Our High Power Converters are available in Single Phase, Three Phase, Poly Phase, AC Switch, Parallel Configuration and Static Switch configurations.  Options include Air or Liquid Cooled, Voltage Feedback, Current Feedback, Thermal Feedback, Snubbers, Laminated Bus, Filter Capacitors, Output Bus Bars, and Blowers/Fans.  These products are widely used for High-Power Motor Control, High-Power AC-DC Power Suppplies and High-Power DC-DC Power Supplies.

High Power Semiconductor Assemblies

High-Power Semiconductor Assemblies

Our High-Power Semiconductor Assemblies are available with Single, Doubler, Three Phase, Full Bridge, Series Stacks, Parallel, AC Switch, Static Switch, Common Anode/Common Cathode Topologies.  Options for include Air or Liquid Cooled, Bus Bars, Gate Firing Boards, Fuses, Snubbers, Blowers/Fans, Thermal Switches, Insulated Mounting and FiberOptic Interfaces. We offer a wide range of Power Semiconductors to satisfy a wide range of power management requirements.

 

IGBT and SCR Gate Driver Boards

IGBT and SCR Gate Driver Boards

Our IGBT and SCR Gate Driver Boards come in Full Bridge, Half Bridge, 3-Phase Bridge, Single, Doubler, Twelve Pulse, AC Switch and High Voltage Driver circuit boards.  Options for our IGBT and SCR Converters include Voltage Feedback, Current Feedback, Thermal Feedback, Device Fault Protection, Circuit Protection and FiberOptic Interface.  Our SCR and IGBT Controllers are made to fit a wide range of applications and can be quickly customized to meet unique applications.

Custom High Power Systems

Custom High Power Systems

We offer Custom High Power Systems design utilizing our years of experience with power component technologies.  We we can design build entire high power system with state of the art enclosures, digital / analog interface signals, control and monitoring circuitry.  Our advanced cooling techniques with baseplates, heatsinks, fans, blowers and liquid cooling devices ensure your custom power supply design will have the best in thermal management.